键合与封装Bonding & packaging
通过合适界面与连接方式，将结构集成为可使用的样品。Compatible interfaces and interconnects integrate separate structures into usable samples.
关键区别Key distinction
直接键合、阳极键合、胶键合及电互连不能视作同一过程。Direct, anodic and adhesive bonding, as well as electrical interconnection, have different requirements.
项目输入Project inputs
表面、对准、密封、互连、热预算与测试方式Surfaces, alignment, sealing, interconnection, temperature budget and testing.
整理项目需求Prepare a project brief ↗
进一步阅读Further reading
动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.