工艺别急着选 02Choose Carefully 02

工艺别急着拍板，先看问题卡在哪一段。Do not pick a process too fast; first see where the problem really sits.

同一个纳米结构，可能卡在光刻，也可能卡在刻蚀、镀膜、清洗或测试。下面这些页面就是把大问题拆成小问题，方便开聊。The same nanostructure may be limited by lithography, etch, films, cleaning or metrology. These pages split the big question into smaller ones.

01

光刻与直写Lithography & Direct Writing

电子束直写（EBL）、激光直写（LDW）、接触式紫外光刻（Contact UV）、步进式光刻机（Stepper）、深紫外光刻机（DUV）。EBL, LDW, Contact UV, Stepper and DUV route review.

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刻蚀与图形转移Etch & Pattern Transfer

围绕硅、石英、氮化硅、金属和聚合物结构，评估干法、湿法、释放与深硅刻蚀。Dry etch, wet etch, release and DRIE for common materials.

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镀膜与 Lift-offFilms & Lift-off

用于电极、光学薄膜、功能层和种子层，提前确认膜厚、附着层、边界和去胶风险。Review film thickness, adhesion, edges and lift-off risks.

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键合与封装Bonding & Packaging

面向 MEMS、微流控和复合基底，关注对准、表面状态、空腔、密封和后续测试连接。Alignment, surface state, cavities, sealing and test connections.

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切割、减薄与抛光Dicing, Thinning & Polishing

在片径、厚度、划片道、崩边、背面保护和洁净度之间平衡样品可加工性。Balance wafer size, thickness, dicing lanes, protection and cleanliness.

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热处理与掺杂Annealing & Doping

讨论退火温度窗口、气氛、离子注入、扩散、接触电阻和材料兼容性。Annealing window, atmosphere, implantation, diffusion and compatibility.

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纳米压印与母版Nanoimprint & Masters

适合周期结构、光栅、微透镜和重复阵列，重点看母版精度、脱模和面积放大。For periodic structures, gratings, microlenses and repeated arrays.

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双光子与 3D 微结构Two-photon & 3D Microstructures

用于微支架、微透镜、微流道和自由曲面结构，提前定义材料、尺寸、精度和后处理。Materials, size, precision and post-processing for 3D microstructures.

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表征与测试Metrology & Testing

结合 SEM、显微、轮廓、椭偏、电学、光学或 RF 测试，把结果转化为下一轮依据。Turn SEM, optical, profile, ellipsometry, electrical, optical or RF results into next-step evidence.

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