气密性测试与泄漏率评估Hermeticity and leak testing

把“封住了吗”转换成被测边界、介质、压差、允许泄漏、预处理和可交付的测试记录。Turn “is it sealed?” into a test boundary, medium, pressure differential, allowable leak, conditioning and usable record.

它适合回答什么What it is suited to answer

气密性与泄漏测试用于确认 MEMS 空腔、传感器封装、微流控芯片、接头或其他密封结构在约定条件下是否存在可检出的泄漏，并把结果连同测试条件一并保留。测试方法、检出能力与是否适合氦质谱、压降、保压、浸液冒泡或其他方案，应由实际结构、介质相容性、接口和验收用途共同确认。Hermeticity and leak testing checks whether MEMS cavities, sensor packages, microfluidic chips, fittings or other sealed structures exhibit detectable leakage under agreed conditions. Method and detection capability depend on the structure, medium compatibility, interfaces and acceptance purpose.

适合什么需求Good For

MEMS 空腔封装、硅玻璃或晶圆级键合后的密封确认、微流控通道与接口泄漏排查、惰性气体或真空相关封装，以及需要将漏点判断写进来料、工序或出货验收的项目。MEMS cavities, sealed silicon-glass or wafer-level bonds, microfluidic channels and ports, inert-gas or vacuum packages, and projects requiring a documented leak check.

需要准备什么Prepare First

提供结构截面或照片、腔体体积或通道尺寸、材料和胶黏剂、可接入的端口、被测介质、允许压力或真空范围、预期使用环境、允许泄漏的定义、预处理/清洗要求、样品数量和希望保留的原始记录。Provide a cross-section or photos, cavity volume or channel size, materials and adhesives, accessible ports, test medium, permitted pressure or vacuum range, use environment, leak criterion, conditioning, sample count and required raw records.

常见风险Common Risks

把“无明显气泡”直接等同于气密、没有定义压差和保压时间、端口本身漏气、胶黏剂放气或吸附、温度波动、样品受压变形，以及将不同方法或不同换算口径的结果直接比较，都会造成误判。Equating no visible bubbles with hermeticity, omitting pressure differential or dwell time, leaky fixtures, adhesive outgassing or adsorption, temperature drift, pressure-induced deformation and comparing unlike methods can all mislead.

送样与验收怎样写才可执行Make handoff and acceptance executable

先画出测试边界：哪些腔体、键合线、通道和端口被包含，哪些功能孔需封堵；再写清测试介质、初始状态、预处理、压力或真空曲线、稳定时间、测试时长和允许判定。报告至少应能追溯样品编号、夹具与端口状态、条件曲线、结果、异常和复测处理。若是批量比较，同一批次尽量固定夹具、密封方式和判定窗口。First draw the test boundary: included cavities, bond lines, channels and ports, plus openings to be sealed. Then specify medium, initial state, conditioning, pressure or vacuum profile, stabilization, duration and pass/fail rule. Retain sample IDs, fixture/port state, condition trace, results, anomalies and retest handling.

与键合工艺和流量测试的边界Boundary with bonding process and flow testing

泄漏测试是对约定密封边界的验证，不替代键合工艺本身的开发，也不自动证明器件性能。若前一步还在确定上下片材料、表面、颗粒、对准和热预算，先看晶圆键合加工准备；若是硅玻璃腔体，核对阳极键合与硅玻璃封装；若重点是微流控通道的流阻、阀门或功能性输运，还需另行定义流体条件，而不能只用密封判定代替。Leak testing validates an agreed sealed boundary; it does not replace bond-process development or prove device performance. Start with wafer-bonding preparation for material, surface, alignment and thermal decisions, and specify fluidic functional conditions separately where needed.

推荐下一步Next Step

先提交结构图和允许泄漏的定义，再确认方法、夹具与报告口径。Submit a structure drawing and leak criterion before selecting method, fixture and report format.

素微会先将结构、介质、边界条件与验收用途整理为可核对的测试需求，再匹配合适资源；页面不构成任何检出能力、设备可用性或测试结论的预先承诺。素微 first turns structure, medium, boundary conditions and acceptance use into a checkable request; this page is not a pre-commitment to detection capability, tool availability or result.

提交气密性测试需求Submit hermeticity test request 查看键合与封装导航Open bonding and packaging route