专业词入口Topic Entry

晶圆键合加工，成功率往往由键合前的表面与结构决定。Wafer bonding yield is often decided before the wafers enter the bonder.

硅硅、硅玻璃、阳极键合、直接键合和低温键合的窗口不同。需要把材料组合、表面膜层、粗糙度、颗粒、翘曲、空腔、对准和后续热预算一起判断。Silicon, glass, anodic, direct and low-temperature bonding each impose different surface and thermal constraints.

01

适合什么需求Good For

MEMS 空腔与真空封装、硅玻璃微流控、SOI/多层结构、盖片保护，以及需要晶圆级对准和密封的器件。MEMS cavities, microfluidics, multilayer stacks, cap protection and wafer-level sealing.

02

需要准备什么Prepare First

上下片材料、片径与厚度、晶向、表面膜层和粗糙度、图形/空腔深度、对准精度、耐温上限、键合区域和切割方案。Wafer pair, size, orientation, surface films, roughness, cavities, alignment, thermal limit and dicing plan.

03

常见风险Common Risks

颗粒导致空洞、表面粗糙或翘曲超窗、热膨胀失配、空腔压差、对准偏移、金属/胶层污染，以及后续切割开裂或漏气。Particles, voids, roughness, bow, thermal mismatch, alignment error, contamination and leakage.

推荐下一步Next Step

先选键合机制，再把清洗、对准、热预算与验收串成完整路线。Choose the bonding mechanism, then align cleaning, registration, thermal budget and acceptance.

建议提交上下片截面图、键合区/空腔版图、表面膜层、允许温压范围和交付后的气密、剪切或红外检查要求。微纳Hub 会先判断阳极、直接、金属、玻璃浆料或聚合物键合是否匹配。Share cross-sections, bonding areas, surface films, temperature/pressure limits and hermetic, shear or IR acceptance needs.

提交晶圆键合需求Submit bonding request查看键合与封装工艺Open bonding route