01
精密热台Precision Hot Plate
适合光刻胶软烘/硬烘、样品加热和研发工艺验证。选型时重点核对工作面尺寸、目标温区、面内均匀性、固定方式、程序控制和洁净兼容性。For resist bake, sample heating and R&D validation. Key inputs include surface size, temperature range, uniformity, sample holding, programs and clean compatibility.
02
桌面涂胶/显影Benchtop Coat/Develop
适合晶圆、方片、碎片及异形样品。选型时重点核对尺寸范围、转速与程序、吸盘、胶液/显影液兼容、排液排风和交叉污染控制。For wafers, coupons, fragments and non-standard substrates. Review size, spin programs, chucks, chemical compatibility, drainage, exhaust and contamination control.
03
成套前处理条件Compact Process Set
如果目标是把涂胶、烘烤、显影环节放回实验室,可按样品、频率、安装环境、预算和交期一起梳理,不用先指定某个型号。For bringing coating, bake and develop in-house, start from samples, usage, utilities, budget and timeline rather than a model number.