识别表面污染Identify contamination
小颗粒和薄层代表不同污染物，而不是器件结构。Particles and residue represent contamination, not device features.
湿法清洗Wet cleaning
针对污染类型选择表面清洗，并结合漂洗、干燥控制残留。Cleaning targets contamination and uses compatible rinsing and drying to control residues.
在首页观看原理演示Watch the interactive study ↗湿法清洗Wet cleaning
针对污染类型选择表面清洗，并结合漂洗、干燥控制残留。Wet cleaning
关键区别Key distinction
RCA、溶剂清洗和氧化物去除用途不同；不提供可直接执行的化学配方。RCA, solvent cleaning and oxide removal have different purposes. No executable chemical recipe is provided.
观察路径What to observe
清洗作用于污染Cleaning acts on contamination
按材料兼容性选择清洗，不把表面整体刻掉。Cleaning is selected for compatibility, not blanket substrate removal.
漂洗带走残留Rinse away residues
已分离的污染与残留需要离开样品。Detached contamination and residues must leave the sample.
干燥后的表面Surface after drying
清洁不等于原子级完美，仍需合适的表面检验。Clean does not mean atomically perfect; verification remains necessary.
项目输入Project inputs
污染物、基底、已有膜层、表面终止和后续工艺Contamination, substrate, existing films, termination and subsequent processing.
整理项目需求Prepare a project brief ↗
进一步阅读Further reading
动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.