图形分割Fracture the pattern
版图分成矩形等可写单元，不是单个圆点。Pattern fracturing produces writable shapes rather than single round spots.
可变成形束电子束曝光Variable-shaped beam
把图形分解成可变尺寸的矩形等单元，利用成形电子束逐单元曝光。Pattern fracturing creates writable shapes, exposed as shots of a variable-shaped electron beam.
在首页观看原理演示Watch the interactive study ↗可变成形束电子束曝光Variable-shaped beam
把图形分解成可变尺寸的矩形等单元，利用成形电子束逐单元曝光。Variable-shaped beam
关键区别Key distinction
VSB 是电子束写入方式之一，不是独立于电子束的第三种辐射源。VSB is an electron-beam writing strategy, not a third radiation source alongside electrons and light.
观察路径What to observe
改变束形Shape the beam
矩形电子束尺寸随写入单元改变。The rectangular electron beam changes with each shot.
逐单元曝光Expose successive shots
每次 shot 覆盖一个区域，图形由这些区域组合。Each shot exposes an area; successive shots compose the pattern.
显影与边界Development and edges
仍需显影；束形方法不消除散射或剂量问题。Development is still required; shaping does not remove scattering or dose effects.
项目输入Project inputs
图形分割、shot 数、束形、写入与掩模需求Fracturing, shot count, beam shape and mask or substrate requirements.
整理项目需求Prepare a project brief ↗
进一步阅读Further reading
动画为非等比例原理示意，粒子、颜色、光路及材料厚度为解释性表达，不是测量结果或设备参数。Animation is not to scale. Particles, colors, optical paths and thicknesses are explanatory, not measurement results or tool parameters.