版图文件与目标尺寸Layout Files and Target Dimensions
GDS/DXF/PDF 文件、关键线宽或周期、容差范围、对准关系和有效加工面积。GDS/DXF/PDF files, key CD or period, tolerance, overlay relationship and effective area.
发资料前看一眼 05Before You Send 05
发需求前看一眼，别让关键参数偷偷溜走。Check once before sending; key parameters love to sneak away.
不用一开始就十全十美，但线宽、材料、数量、检测方式这些越早说明白，对方越少靠猜，报价也更像报价。It does not need to be perfect, but CD, material, quantity and metrology should appear early. Less guessing, better quoting.
材料、厚度与前道状态Materials, Thickness and Incoming State
基底材料、薄膜材料与厚度、片径或样品尺寸、是否已有清洗、镀膜、键合或前道图形。Substrate, film materials, thickness, wafer or sample size, and any prior process state.
检测方式与验收标准Metrology and Acceptance Criteria
SEM、显微、轮廓、椭偏、电学、光学或 RF 测试需求，以及样品数量和交付形式。SEM, optical, profilometry, ellipsometry, electrical, optical or RF test needs, quantity and deliverables.
懒人邮件模板Quick Email Template
1. 项目目标：想做什么结构，用于什么测试或验证。1. Project goal: target structure and intended test or validation.
2. 材料与样品：衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸：GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收：目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.