电子束曝光 / 电子束直写Electron-Beam Lithography
用于纳米级图形、高精度小面积结构、超表面、光栅和研究样品。沟通时重点说最小线宽、线距、面积、胶型、剂量窗口和套刻要求。For nanoscale high-precision patterns. Discuss CD, spacing, area, resist, dose window and overlay.
工艺词库Glossary
业内常用缩写先看懂，后面沟通会快很多。Understand the common abbreviations before the project conversation starts.
很多微纳加工需求卡住，不是因为没人能做，而是因为 EBL、DUV、RIE、ICP、DRIE、PVD、ALD、Lift-off、NIL、SEM、GDS 这些词背后的限制没有说清楚。Many requests get stuck because the limits behind terms like EBL, DUV, RIE, ICP, DRIE, PVD, ALD, Lift-off, NIL, SEM and GDS are not clear enough.
激光直写Laser Direct Writing
常用于微米级图形、快速打样和掩膜版前验证。需要关注分辨率、面积、基底尺寸、对准 mark 和是否要后续刻蚀或镀膜。Useful for micron-scale patterns, fast prototyping and mask-route validation.
深紫外光刻 / 步进式光刻机Deep UV / Stepper
适合明确版图、对准关系和工艺窗口的项目。通常比“能不能曝光”更重要的是版图、掩膜、套刻、片径和批量一致性。Works best with clear layout, alignment, masks, wafer format and process window.
反应离子刻蚀Reactive Ion Etching
用于介质、聚合物或浅刻蚀图形转移。关键是材料、掩膜、目标深度、选择比、表面粗糙度和是否会损伤下层。Used for pattern transfer; material, mask, depth, selectivity and damage risk matter.
ICP 刻蚀 / 深硅刻蚀ICP / Deep Reactive Ion Etching
常用于硅、III-V、深槽、通孔和高深宽比结构。需要提前说侧壁、深度、刻穿、掩膜耐受和背面保护。For deeper or high-aspect-ratio etch; sidewall, depth, through-etch and mask durability are key.
物理气相沉积 / 原子层沉积Physical Vapor Deposition / Atomic Layer Deposition
PVD 常用于金属和部分介质膜；ALD 适合高一致性、包覆性和薄膜控制。沟通时说材料、膜厚、温度、台阶覆盖和后续图形化。PVD handles many metal films; ALD helps conformality and thin-film control.
剥离工艺Lift-off
常用于金属电极、光学薄膜图形化和小批量样品。关键风险是残胶、边缘毛刺、膜太厚、附着层和清洗兼容性。Common for patterned metal or optical films; residue, edge quality and adhesion matter.
纳米压印Nanoimprint Lithography
适合周期结构、光栅、微透镜、重复阵列和母版复制。重点看母版、脱模、残胶层、压印面积和后续图形转移。For periodic arrays, gratings, microlenses and master replication.
扫描电镜 / 原子力显微镜SEM / AFM
SEM 常看表面、线宽、截面和缺陷；AFM 常看高度、粗糙度和局部形貌。验收前要明确看哪种图、放大倍数和测量位置。SEM checks surfaces and cross-sections; AFM checks height and roughness.
版图文件与格式转换Layout Files and Conversion
GDS 是微纳加工常见版图格式；DXF、PDF 或截图常需要转换和检查。单位、layer、cell、闭合图形和最小线宽都要确认。GDS is common for fabrication; DXF, PDF or screenshots often need conversion and checks.
版图软件Layout Tools
KLayout、L-Edit、LayoutEditor、GDSFactory、PHIDL 等工具用于查看、绘制、转换和检查版图。报价前最好先做尺寸和 layer 自查。Layout tools help view, draw, convert and verify layers and dimensions.
关键尺寸 / 套刻Critical Dimension / Overlay
CD 是项目成败的核心尺寸，套刻是多层结构之间的对准关系。多层曝光、电极、开窗和封装项目尤其要提前说明。CD and overlay define whether multilayer fabrication can be accepted.
配套入口Related Entry
术语看懂后，再去对应工艺页看怎么准备资料。After the terms, open the matching process page and prepare the inputs.
词库只解决“听得懂”，真正推进项目还要把材料、尺寸、版图、检测和周期说清楚。The glossary helps with vocabulary; project progress still depends on materials, dimensions, layout, metrology and timing.
打开工艺导航Open process map