适合什么需求Good Fit
金属电极、pad、纳米/微米互连、对准 mark、传感器电极、光电子器件电极和不适合直接刻蚀金属的图形。Electrodes, pads, interconnects, alignment marks, sensor electrodes and metal patterns that are hard to etch.
专业词入口Topic Entry
Lift-off 金属电极，别只写“镀一层金”。For lift-off electrodes, "deposit gold" is not enough.
Lift-off 常用于 Ti/Au、Cr/Au、Pt、Al、Ni 等金属电极、互连、对准标记和测试结构。决定成败的不是单一镀膜动作，而是光刻胶形貌、膜厚、附着层、沉积方式、台阶覆盖和去胶窗口。Lift-off is used for metal electrodes, interconnects, marks and test structures; resist profile and film stack matter.
需要准备什么Inputs Needed
版图、最小线宽、金属材料和膜厚、附着层、基底材料、是否能加热、数量、清洗限制、SEM 或电学验收要求。Layout, CD, metal stack and thickness, adhesion layer, substrate, temperature limit, quantity, cleaning limits and acceptance checks.
常见风险Common Risks
胶厚不够、侧壁挂膜、金属桥连、残胶、附着力差、溅射导致 Lift-off 困难，以及小间距电极后续短路。Insufficient resist, sidewall coating, bridging, residue, poor adhesion, sputter lift-off difficulty and shorts.
推荐下一步Next Step
把金属堆栈、线宽、胶厚和验收方式一起确认。Confirm metal stack, CD, resist thickness and acceptance method together.
微纳Hub 会先判断是否适合 Lift-off，还是应改成金属刻蚀、先做硬掩膜、调整线宽间距或更换沉积方式。对电学样品，最终验收最好同时定义显微/SEM 和导通测试。Some projects should switch to metal etch, hard masks, layout changes or a different deposition route.
提交 Lift-off 电极需求Submit lift-off electrode request