专业词入口Topic Entry

MEMS 加工不是只问“能不能刻”，还要看结构怎么释放、封装和测试。MEMS fabrication needs release, packaging and test planning, not only etch feasibility.

硅沟槽、通孔、薄膜、悬臂梁、腔体和传感结构，往往会跨越光刻、DRIE/ICP、镀膜、退火、键合、切割和封装。越早说明结构用途和交付状态，越容易判断路线。MEMS features often span lithography, DRIE/ICP, films, anneal, bonding, dicing and packaging.

01

适合什么需求Good Fit

沟槽、通孔、腔体、薄膜、梁、膜片、喷嘴、压力/惯性/声学/热学传感结构和小批量验证样品。Trenches, through holes, cavities, membranes, beams, nozzles and sensor prototype structures.

02

需要准备什么Inputs Needed

GDS/DXF、结构尺寸、目标深度、深宽比、材料栈、片厚片径、正背面工艺、释放方式、数量和验收方式。GDS/DXF, dimensions, depth, aspect ratio, stack, wafer size, front/backside process, release, quantity and acceptance.

03

常见风险Common Risks

深刻蚀侧壁波纹、残留、薄膜应力、释放粘连、晶圆翘曲、键合颗粒、切割崩边和测试夹具不匹配。Scalloping, residue, film stress, stiction, wafer bow, bonding particles, dicing chips and fixture mismatch.

推荐下一步Next Step

先确认结构剖面、材料栈和最终交付形态。Confirm cross-section, material stack and delivery state first.

微纳Hub 会先判断是硅深刻蚀、表面微加工、体硅加工、键合封装，还是需要先做工艺窗口验证。若项目涉及流体、电学或力学测试，请把装夹和测试条件一起说明。MN Fab Hub can route silicon bulk micromachining, surface micromachining, bonding, packaging or process-window validation.

提交 MEMS 加工需求Submit MEMS request