适合什么需求Good Fit
PDMS 翻模母版、几十到数百微米厚的通道/腔体、微柱阵列、临时厚胶掩膜、电铸或电镀结构。PDMS masters, tens-to-hundreds micron channels or cavities, micropillar arrays, temporary thick masks and electroplating molds.
专业词入口Topic Entry
SU-8 厚胶光刻，先把厚度、深宽比和脱模方式说清楚。SU-8 thick-resist lithography needs thickness, aspect ratio and release needs defined first.
SU-8 常用于微流控母模、MEMS 厚胶结构、微柱阵列和电镀模具。它不是普通光刻的简单加厚版，胶厚、曝光剂量、显影时间、烘烤应力和基底附着都会影响成败。SU-8 is used for microfluidic masters, MEMS thick structures, micropillar arrays and plating molds. Thickness, exposure, development, stress and adhesion all matter.
需要准备什么Inputs Needed
目标胶厚、最小线宽/间距、最高深宽比、图形面积、基底材料、是否需要硅烷化脱模、数量和 SEM/轮廓验收方式。Target thickness, minimum CD/space, aspect ratio, pattern area, substrate, silanization or release needs, quantity and metrology.
常见风险Common Risks
厚胶开裂、底部残胶、侧壁倾斜、显影不透、图形倒塌、附着不稳、PDMS 脱模撕裂和重复翻模后的母版损伤。Cracking, footing residue, sloped walls, incomplete development, pattern collapse, weak adhesion, PDMS tearing and master damage.
推荐下一步Next Step
先判断是做 SU-8 母模、厚胶掩膜，还是需要换成刻蚀路线。First decide whether this should be an SU-8 master, thick-resist mask or an etched route.
微纳Hub 会根据厚度、线宽、面积、后续翻模或刻蚀要求，判断适合 SU-8 厚胶光刻、硅/玻璃刻蚀、金属模具还是纳米压印母版。已有 DXF/GDS、通道截图或手绘剖面都可以先发。MN Fab Hub can route SU-8 lithography, silicon/glass etch, metal molds or nanoimprint masters based on thickness, CD, area and downstream use.
提交 SU-8 厚胶光刻需求Submit SU-8 request 也可先看微流控加工Open microfluidic topic