常见问题FAQ

微纳加工不是先问“多少钱”，而是先问“信息够不够判断”。Micro/nano fabrication starts with enough information to judge the route.

这里把业内最常见的问题放在一起：能不能做、该找什么工艺、报价前要准备什么、资料不完整怎么办。先把问题说清楚，后面匹配平台、公司或供应商才更快。These are the questions that usually appear before quotation: feasibility, process route, required inputs and what to do when the data is incomplete.

微纳加工项目报价前需要准备什么？What should be prepared before quotation?

最少要有项目目标、材料和基底、关键尺寸、加工面积、数量、版图或截图、膜层厚度、检测方式、期望周期和不能承受的工艺限制。资料不完整也可以先发，但要把“不确定的地方”标出来。Prepare the goal, material, substrate, critical dimensions, area, quantity, layout or screenshot, film thickness, metrology method, timeline and process limits. Incomplete inputs are fine if the unknowns are clearly marked.

看资料清单Open checklist 提交需求Submit request

电子束曝光、激光直写、接触式紫外、Stepper、DUV 怎么选？How to choose EBL, LDW, Contact UV, Stepper or DUV?

小面积、高精度、纳米级线宽先看电子束曝光（EBL）；微米级图形或较大面积样品常看激光直写（LDW）、接触式紫外（Contact UV）或步进式光刻机（Stepper）；DUV 更适合有明确工艺窗口、版图、对准和批量验证要求的项目。EBL fits small-area nanoscale patterns; LDW, Contact UV and Stepper routes fit micron-scale or larger-area samples; DUV is usually for clearer process windows, layouts, alignment and batch validation.

看光刻与直写Open lithography

只有显微图、论文图或手绘草图，能不能先判断？Can a microscope image, paper figure or sketch be enough to start?

可以先判断方向，但正式报价通常还需要尺寸、材料、层结构、加工面积、数量和验收方式。图片适合用来说明目标，不适合直接替代 GDS、DXF、PDF 版图或明确尺寸表。It is enough for a first direction check, but quotation usually needs dimensions, materials, stack, area, quantity and acceptance method. Images explain intent; they do not replace layout files or dimension tables.

刻蚀项目最容易漏掉哪些信息？What is often missing in etch requests?

常漏材料堆栈、目标深度、掩膜材料和厚度、选择比、侧壁要求、可接受粗糙度、是否刻穿、是否要保护背面、后续清洗和测试方式。RIE、ICP、DRIE 的判断都离不开这些边界。Etch requests often miss the stack, target depth, mask material and thickness, selectivity, sidewall requirements, roughness, through-etch needs, backside protection, cleaning and metrology.

看刻蚀入口Open etch page

镀膜和 Lift-off 为什么要提前说胶、膜厚和台阶？Why do resist, film thickness and step height matter for Lift-off?

Lift-off 很怕残胶、侧壁包覆、膜太厚、附着层不合适和图形边界不清。提前说明胶型、膜厚、金属或介质材料、附着层、热预算和是否要做电学/光学测试，能减少返工。Lift-off is sensitive to residue, sidewall coating, excessive film thickness, adhesion layers and unclear edges. Resist, film thickness, material, adhesion, thermal budget and test needs should be known early.

看镀膜 Lift-offOpen film route

微纳Hub 是直接加工公司吗？Is MN Fab Hub itself a fabrication company?

微纳Hub 不是把自己包装成万能加工公司，而是先做需求判断、工艺路线、资源匹配、样品沟通和资料整理。合适时再匹配加工公司、平台或供应商，让需求更容易被有效报价和执行。MN Fab Hub is not presented as an all-purpose fab. It helps with request review, process routing, resource matching and communication, then points the project toward suitable companies, platforms or suppliers.

下一步Next

如果你已经有样品、版图或论文图，可以先发来做第一轮判断。If you already have a sample, layout or paper figure, send it for a first route check.

不用等资料完美。先把材料、尺寸、目标结构、想验证什么和已有文件发来，微纳Hub 会先帮你看缺什么、该找哪类工艺资源。The inputs do not need to be perfect. Send the material, dimensions, target structure, validation goal and available files first.

提交项目需求Submit request