工艺小站 01Process Stop 01
光刻与直写这件事Lithography & Direct Writing
适合电子束直写(EBL)、激光直写(LDW)、接触式紫外光刻(Contact UV)、步进式光刻机(Stepper)、深紫外光刻机(DUV)和套刻周期结构需求。For EBL, LDW, Contact UV, Stepper, DUV and overlay periodic-structure requirements.
先把这些说清楚What to Spell Out
把这些说清楚,别人就不用隔空猜样品;报价和可行性也会靠谱很多。When these points are clear, nobody has to guess the sample from thin air; feasibility and quotes get much more reliable.
懒人邮件模板Quick Email Template
1. 项目目标:想做什么结构,用于什么测试或验证。1. Project goal: target structure and intended test or validation.
2. 材料与样品:衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸:GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收:目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.
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查看激光直写与光刻加工准备页Open LDW and lithography prep page
查看接触式光刻加工准备页Open contact UV prep page
查看 DUV/Stepper 光刻准备页Open DUV/Stepper prep page