工艺小站 03Process Stop 03
镀膜与 Lift-offFilms & Lift-off
适合金属电极、光学薄膜、种子层、功能膜、Lift-off 和去胶清洗。For metal electrodes, optical films, seed layers, functional films, lift-off and resist removal.
先把这些说清楚What to Spell Out
把这些说清楚,别人就不用隔空猜样品;报价和可行性也会靠谱很多。When these points are clear, nobody has to guess the sample from thin air; feasibility and quotes get much more reliable.
懒人邮件模板Quick Email Template
1. 项目目标:想做什么结构,用于什么测试或验证。1. Project goal: target structure and intended test or validation.
2. 材料与样品:衬底、膜层、尺寸、数量、来源和特殊处理限制。2. Material and sample: substrate, films, size, quantity, source and handling limits.
3. 版图与尺寸:GDS/截图、最小线宽/线距、面积、Layer/Cell 和对准要求。3. Layout and dimensions: GDS/screenshots, CD/space, area, Layer/Cell and alignment.
4. 工艺与验收:目标深度/膜厚、误差、检测方式、交付形式和期望时间。4. Process and acceptance: depth/thickness, tolerance, metrology, deliverables and schedule.
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查看镀膜加工与薄膜沉积准备页Open film deposition prep page
查看 ALD 原子层沉积准备页Open ALD deposition prep page
查看 PECVD 薄膜沉积准备页Open PECVD deposition prep page
查看 LPCVD 薄膜沉积准备页Open LPCVD deposition prep page
查看磁控溅射镀膜准备页Open sputtering prep page
查看电子束蒸发镀膜准备页Open evaporation prep page
查看 Lift-off 金属电极准备页Open lift-off electrode prep page