适合什么需求Good For
Au、Ti、Cr、Al 等金属电极，粘附层与种子层，需要较强方向性的 Lift-off 图形，以及有明确膜厚和表面质量要求的薄膜。Metal electrodes, adhesion or seed layers, directional lift-off patterns and films with defined thickness and surface requirements.
专业词入口Topic Entry
电子束蒸发镀膜，先确认材料栈、方向性和 Lift-off 边界。E-beam evaporation starts with the material stack, directionality and lift-off boundary.
电子束蒸发常用于金属电极、粘附层、种子层和部分光学薄膜。路线判断要同时考虑材料蒸气压、基底温度、台阶覆盖、膜应力、腔体兼容性及后续图形化。E-beam evaporation is commonly used for electrodes, adhesion or seed layers and selected optical films, with feasibility driven by material, thermal budget, step coverage, stress and patterning.
需要准备什么Prepare First
完整材料顺序与纯度、各层膜厚及容差、基底和已有膜层、样品尺寸与数量、胶型与侧壁、温度上限、是否旋转及验收指标。Full material sequence, purity, thickness tolerance, substrate stack, size, quantity, resist profile, thermal limit, rotation and acceptance metrics.
常见风险Common Risks
粘附不足、金属互扩散，厚膜应力与剥落，颗粒或喷溅，片内均匀性不足，深结构阴影效应，以及胶层耐温或 Lift-off 开口被封。Poor adhesion, interdiffusion, stress, peeling, particles, non-uniformity, shadowing and resist or lift-off failure.
推荐下一步Next Step
把“蒸发金属”转换成材料顺序、膜厚、图形和验收四组条件。Translate “evaporate metal” into material order, thickness, pattern and acceptance conditions.
请提交基底与已有膜层、目标材料顺序、各层膜厚、最小线宽与胶层剖面、样品尺寸、温度上限及电阻/附着/膜厚验收方式。微纳Hub 会先比较电子束蒸发与热蒸发、磁控溅射等路线。Share the substrate stack, material order, thickness, minimum feature, resist profile, size, thermal limit and acceptance method so evaporation can be compared with sputtering.
提交电子束蒸发需求Submit evaporation request查看镀膜与 Lift-off 工艺导航Open film route