适合什么需求Good For
金属电极、光学薄膜、介质膜、种子层、保护层、透明导电膜、二维材料接触和需要后续 Lift-off 或刻蚀的膜层。Metal electrodes, optical films, dielectrics, seed layers, passivation, transparent conductors and patterned film stacks.
专业词入口Topic Entry
镀膜加工不只问材料和膜厚，还要说清基底、窗口和验收。Film deposition needs substrate, process window and acceptance details.
镀膜加工常见路线包括蒸发、溅射、ALD、PECVD 和组合薄膜。真正影响可行性的是材料体系、目标膜厚、附着层、基底耐温、已有图形台阶、均匀性、应力和后续电学或光学测试。Deposition route depends on material, thickness, adhesion, substrate limits, step coverage, uniformity, stress and downstream testing.
先准备什么Prepare First
材料、膜厚、允许误差、附着层、片径或小片尺寸、表面状态、耐温上限、是否已有胶/图形和后续测试方式。Material, thickness, tolerance, adhesion layer, sample size, surface state, temperature limit, incoming pattern and tests.
常见风险Common Risks
附着力不足、台阶覆盖差、膜应力导致翘曲、温度损伤前道结构、颗粒污染、厚膜开裂和电阻/折射率验收没定义。Weak adhesion, poor step coverage, stress, thermal damage, particles, cracking and undefined electrical or optical acceptance.
推荐下一步Next Step
先判断是 PVD、ALD、CVD，还是需要和光刻/Lift-off 组合。Choose PVD, ALD, CVD or a lithography plus lift-off route.
如果是图形化金属电极，镀膜动作前还要看光刻胶形貌和 Lift-off 窗口；如果是高深宽比结构，ALD 的覆盖能力可能比蒸发或溅射更关键。微纳Hub 会先按材料、基底和验收目标帮你拆路线。Patterned electrodes depend on resist profile and lift-off window; high-aspect-ratio structures often make ALD coverage decisive.
提交镀膜加工需求Submit film request 需要图形化金属？看 Lift-off 金属电极Patterned metal? Open lift-off topic