适合什么需求Good For
微纳结构侧壁与层间截面、芯片局部失效、孔洞或残留定位、截面尺寸测量，以及 TEM 薄片制备。Sidewalls, buried interfaces, local failures, voids, residues, dimensional checks and TEM lamellae.
专业词入口Topic Entry
FIB 截面制样，先把目标位置、截面方向和观察问题标清楚。FIB cross-sectioning starts with an exact site, direction and inspection question.
FIB/SEM 可在指定位置开截面，用于观察层间结构、侧壁、空洞、残留和局部失效，也可制备 TEM 薄片。真正影响结果的是目标定位、材料对离子束的敏感性、保护层、截面朝向和需要保留的证据，而不只是“拍一张截面图”。FIB/SEM enables site-specific cross-sections and TEM lamellae; useful results depend on targeting, material sensitivity, protection and orientation.
需要准备什么Prepare First
样品材料与完整膜层、目标点的光镜/SEM 定位图、截面方向、关注尺寸、目标数量、是否需导电处理、图像和原始数据要求。Material stack, site map, cross-section direction, target dimensions, count, coating and deliverables.
常见风险Common Risks
切错位置或方向、离子束损伤与注入、再沉积、帘幕效应、充电、软材料变形，以及没有保护层导致表面结构被破坏。Wrong-site cuts, ion damage, redeposition, curtaining, charging, deformation and surface loss.
推荐下一步Next Step
先做目标点位图，再确定粗切、精抛和成像参数。Map the target site before deciding milling, polishing and imaging conditions.
请在低倍图或版图上标出目标点、截面线和朝向，并说明要回答的问题。微纳Hub 会先判断普通机械截面、FIB 截面或 TEM 薄片哪种更合适，再把保护层、点位数量、倍率、标尺和原始数据列入验收。Mark the site, cut line and viewing direction so mechanical cross-sectioning, FIB or TEM preparation can be compared.
提交 FIB 截面需求Submit FIB request查看表征与测试导航Open metrology route