微纳Hub一站式聚合平台
专业词入口Topic Entry
等离子表面活化常用于去除有机污染、提高润湿性，或为 PDMS、玻璃、硅及部分聚合物的后续贴合做准备。它不是通用“增强附着力”的保证：基底材料、暴露膜层、处理后等待时间、环境与下游键合方式都要一起确认。Plasma activation can remove organics, improve wettability and prepare PDMS, glass, silicon or some polymers for joining. It is not a universal adhesion guarantee: materials, exposed films, post-treatment delay, environment and downstream bonding must be reviewed together.
微流控 PDMS-玻璃贴合、玻璃或硅片直接贴合前的表面准备、涂覆/封装前的润湿性改善，以及需要比较处理前后接触角或贴合状态的试片项目。PDMS-to-glass microfluidics, surface preparation before glass or silicon joining, wettability improvement before coating or packaging, and pilot work comparing contact angle or joining condition.
上下片材料与所有暴露膜层、尺寸与数量、清洗/储存历史、目标界面和遮蔽区域、后续贴合或涂覆步骤、允许温升、处理到键合的最长等待时间，以及接触角、外观、剥离或气密等验收要求。未知项标为待平台确认。Provide both-side materials and exposed films, size and count, cleaning/storage history, target interface and masked areas, next joining/coating step, thermal limit, maximum treatment-to-bond delay and acceptance criteria such as contact angle, appearance, peel or leak checks.
活化效果会随存放时间、空气中污染和材料回弹而变化；对敏感金属、有机膜、图形胶、薄膜应力或器件表面，过度处理可能引入损伤或状态漂移。不能只以一次接触角读数推断长期贴合强度，应通过试片和实际下游条件确认。Activation can change with delay, airborne contamination and material recovery. Sensitive metals, organic films, resist patterns, stressed films and device surfaces may be altered by excessive treatment. A single contact-angle value does not prove long-term bond strength; confirm with pilots and actual downstream conditions.
推荐下一步Next Step
请提交材料栈、样品照片、目标贴合/涂覆流程、历史清洗方式和验收优先级。微纳Hub 可协助将需求整理为平台可核对的试片清单；具体气体、功率、时间、设备兼容性和安全边界应由接收平台确认，不在此页承诺跨设备通用配方或键合强度。Share the stack, sample photos, target joining/coating flow, cleaning history and acceptance priority. MN Fab Hub can organize a pilot handoff; the receiving facility confirms gases, power, duration, equipment compatibility and safety boundaries. This page does not promise a transferable recipe or bond strength.
提交表面活化需求Submit activation request若目标是晶圆级直接贴合，应把表面状态、对准和后续热预算一并交接。For wafer-level joining, include surface state, alignment and thermal budget.
查看晶圆键合加工准备Open wafer-bonding guidePDMS、玻璃或微流控芯片还要同时确认通道、封口和泄漏测试边界。PDMS, glass and microfluidic work also needs channel, sealing and leak-test definition.
查看玻璃微流控芯片键合Open microfluidic-bonding guide若目标是保留胶图形并清理开口残胶，请转到 Descum 专题，勿与活化混用。For clearing developed openings while preserving resist, use the descum guide rather than this activation route.
查看氧等离子去残胶 DescumOpen oxygen-plasma descum guide