适合什么需求Good For
薄膜/衬底界面、外延层和二维材料晶格；纳米颗粒尺寸与晶相；器件局部缺陷、失效点和精确截面；配合 SAED、EDS 或 EELS 做结构与成分判断。Film interfaces, epitaxy, 2D materials, nanoparticles, local defects and correlated diffraction or spectroscopy.
专业词入口Topic Entry
TEM 制样与测试，先锁定目标界面、取片位置和要回答的问题。TEM preparation starts by fixing the target interface, lift-out location and analysis question.
TEM 可用于观察纳米尺度形貌、晶格、缺陷和多层膜界面，通常需要机械减薄、离子减薄或 FIB 定点薄片。制样路线必须与样品结构、目标区域和成像/能谱模式一起规划，避免得到“薄片做出来了但关键位置不在视野内”的结果。TEM reveals nanoscale morphology, lattice, defects and interfaces, but preparation and analysis modes must be planned around the exact region of interest.
需要准备什么Prepare First
样品尺寸与完整材料栈、目标点位和方向标记、截面/平面视图、需保护的表层、期望分辨率、HRTEM/STEM/SAED/EDS/EELS 模式、薄片数量与原始数据要求。Sample and stack, marked region and orientation, cross-section or plan view, surface protection, resolution, modes, lamella count and raw data.
常见风险Common Risks
目标区域标记不准、FIB 再沉积和离子损伤、薄片弯曲或厚度不均、电子束敏感材料变化、污染，以及把单一局部视野当成整片样品的代表。Targeting error, FIB damage or redeposition, bending, thickness variation, beam sensitivity, contamination and non-representative fields of view.
推荐下一步Next Step
把“拍 TEM”转换成定点图、薄片方案、成像模式与交付矩阵。Turn “take TEM images” into a targeting map, lamella plan, modes and deliverables.
请提交样品照片、材料栈、目标点位截图、截面方向、最关心的界面或缺陷、是否需要晶格/衍射/元素分析，以及原始图、谱图和标尺要求。微纳Hub 会先判断常规截面、FIB 定点薄片或其他制样路线，并明确测试是否会消耗样品。Share photos, stack, target map, section direction, key interface or defect, analysis modes and raw-data needs so the preparation route and sample consumption can be assessed.
提交 TEM 制样测试需求Submit TEM request查看 FIB 截面制样准备Open FIB preparation查看表征与测试导航Open metrology route