宽带、瞬态、纳米结构近场Broadband Near-Field
适合超表面单元、纳米天线、光栅、局域场增强、散射谱和非周期边界。要重点检查网格、PML、色散材料、仿真区域和收敛。Good for metasurface cells, nanoantennas, gratings, local enhancement and broadband spectra.
仿真学习抽屉Simulation Drawer
FDTD、COMSOL、RCWA，不只是“跑个图看看”。FDTD, COMSOL and RCWA are more than pretty field plots.
这里把光学微纳加工里常用的仿真方法、软件入口和项目检查点放在一起。重点不是堆软件名，而是判断：这个结构该用哪种模型，仿真参数怎样变成可加工的线宽、厚度、周期、角度和验收指标。This shelf connects optical simulation methods with fabrication inputs: line width, thickness, period, sidewall angle and acceptance metrics.
先选对模型Choose the Model
同一个“光学仿真”，背后可能是完全不同的问题。The same optical device can require very different numerical tools.
超表面、波导、光栅、薄膜堆栈、微腔、传感器和自由空间光路，不该都往一个软件里硬塞。先判断物理尺度、周期性、材料色散、偏振、入射角和需要看的指标。Metasurfaces, waveguides, gratings, thin-film stacks, cavities, sensors and free-space systems should not be forced into one solver.
复杂几何、多物理耦合Complex Multiphysics
COMSOL 常用于波动光学、热、力、电、流体和材料耦合问题，比如光热、折射率变化、MEMS 形变和微流控传感。Useful for wave optics plus thermal, mechanical, electrical and fluidic coupling.
周期结构、光栅、薄膜栈Periodic Structures
适合周期光栅、超表面单元、衍射效率和角度扫描，速度通常比全 3D FDTD 更友好，但要注意傅里叶阶数和几何分层。Efficient for periodic gratings, metasurface cells, diffraction orders and angle sweeps.
01 软件与官方资料01 Tools and References
商业软件、开源求解器和云端 FDTD，各自解决不同层级的问题。Commercial suites, open solvers and cloud FDTD tools each solve different layers of the work.
Ansys Lumerical FDTD
光子器件、超表面、CMOS 图像传感、微 LED、光栅和薄膜结构常见的商业仿真环境。适合做 FDTD、RCWA、STACK、参数扫描和脚本自动化。A common commercial environment for photonic devices, metasurfaces, gratings, uLEDs and thin-film stacks.
COMSOL Wave Optics
适合波导、耦合器、微腔、光热耦合、材料折射率变化、微流控和多物理场问题。项目里如果同时涉及热、力、电、流体，COMSOL 往往更自然。Useful for wave optics and multiphysics coupling across thermal, mechanical, electrical and fluidic domains.
Tidy3D
面向大规模电磁问题的云端 FDTD 工具，Python API 和教程体系比较完整。适合批量参数扫描、优化和需要脚本管理的光子结构。A cloud FDTD tool with Python workflows, tutorials and large-scale photonic simulation support.
Meep
MIT 相关的开源 FDTD 包，适合希望理解 FDTD 原理、用代码搭建模型、做周期结构和光子晶体研究的人。门槛更高，但更利于看清方法本身。An open-source FDTD package for users who want programmatic control and a deeper view of the method.
S4 / RCWA
S4 是面向分层周期结构的开源 RCWA/FMM 求解器。适合光栅、周期超表面单元、衍射阶次和角度扫描，也适合学习 RCWA 的输入输出逻辑。An open solver for layered periodic structures using RCWA/FMM and S-matrix methods.
Zemax OpticStudio / POP
偏系统级光学设计、自由空间传播和成像链路。做微纳结构时，可用来连接器件级仿真结果和整机光路，但不能替代纳米结构近场求解。Useful for system optics and physical optics propagation, but not a replacement for nanoscale near-field solvers.
02 学习路径02 Learning Path
先学会把问题讲清楚，再学会把软件跑起来。Describe the physics before running the software.
定义器件和指标Device and Metrics
写清楚波长、偏振、入射角、NA、透过率/反射率、相位、Q 值、耦合效率、近场增强或远场图样。Define wavelength, polarization, incident angle, NA, efficiency, phase, Q factor or far-field pattern.
建立几何和材料Geometry and Materials
材料 n/k、膜厚、侧壁角、圆角、粗糙度、刻蚀偏差和基底都要写出来。微纳加工里，理想直角通常只是草图。Include n/k, film thickness, sidewall angle, rounding, roughness, etch bias and substrate.
收敛和误差检查Convergence Checks
至少检查网格、边界、仿真区域、能量守恒、阶数、时间步长或自由度。结果漂亮不代表可信。Check mesh, boundary, domain size, energy balance, diffraction order, time step or degrees of freedom.
03 从仿真到加工03 Simulation to Fabrication
仿真图再好，也要落到加工方能报价的参数。Simulation must become quotation-ready fabrication inputs.
目标结构单元周期、占空比、孔径、线宽、线距、阵列尺寸。Period, duty cycle, aperture, CD, spacing and array size.
材料数据n/k 来源、膜厚、材料牌号、基底和前道处理。n/k source, film thickness, material grade, substrate and prior process.
工艺容差侧壁角、过刻、欠刻、圆角、残胶、膜厚漂移。Sidewall, overetch, underetch, rounding, residue and thickness drift.
版图输出GDS/OASIS、top cell、layer map、bias 规则和 mark。GDS/OASIS, top cell, layer map, bias rules and alignment marks.
验收指标SEM 尺寸、AFM 深度、椭偏膜厚、光谱曲线或效率。SEM CD, AFM depth, ellipsometry, spectrum or efficiency.
扫描表把最敏感参数列出来，决定是否需要 DOE 或多版本版图。List sensitive parameters and decide if DOE or layout variants are needed.
风险说明仿真假设、不可加工结构、最小尺寸风险和检测盲区。Assumptions, unmakeable geometry, CD risks and metrology blind spots.
沟通包仿真截图、参数表、版图、材料栈和希望对方确认的问题。Simulation plots, parameter table, layout, material stack and questions.
需要指导Need Guidance
如果你有仿真结果，但不知道怎么转成工艺需求，可以先发来。If you have simulation results but not a fabrication plan, send the gap.
可以只发结构示意、软件截图、目标波长、材料和想做的样品。重点是先判断：这是不是可加工结构、该用哪类工艺、哪些参数需要先扫一轮。A sketch, screenshot, target wavelength, materials and sample goal are enough to start.
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