光刻与直写Lithography & Direct Writing
电子束直写、激光直写、接触式紫外、Stepper、DUV 等,先看线宽、面积和套刻。EBL, LDW, Contact UV, stepper and DUV routes, driven by CD, area and overlay.
工艺小抄Process Notes
这里不替代正式工艺规范,只负责帮你判断:这个结构大概率该先看光刻、刻蚀、镀膜,还是几个工艺绑在一起。先把方向找对,后面少绕路。These notes do not replace formal process rules. They help you decide whether the structure points to lithography, etch, films or a combined route.
01 先看像哪类活01 Find the Route
电子束直写、激光直写、接触式紫外、Stepper、DUV 等,先看线宽、面积和套刻。EBL, LDW, Contact UV, stepper and DUV routes, driven by CD, area and overlay.
用于硅、二氧化硅、氮化硅、金属、聚合物等材料的干法或湿法刻蚀判断。Dry/wet etch routing for silicon, oxides, nitrides, metals and polymers.
电极、光学薄膜、功能层和种子层相关项目,重点看材料、膜厚和附着层。Electrodes, optical films, functional layers and seed layers.
面向 MEMS、微流控、盖片、密封、空腔和后续测试连接。MEMS, microfluidics, covers, sealing, cavities and test connections.
样品尺寸、片厚、崩边、背面保护、洁净度和加工余量相关内容。Sample size, thickness, chipping, backside protection and allowance.
退火、气氛、温度窗口、离子注入、扩散和材料兼容性判断。Annealing, atmosphere, thermal window, ion implantation and diffusion.
周期结构、光栅、微透镜和重复阵列,重点看母版精度和脱模风险。Periodic structures, gratings, microlenses and array replication.
微支架、微透镜、曲面结构、自由曲面和微 3D 打印相关项目。Micro scaffolds, lenses, curved structures and micro 3D printing.
SEM、显微、轮廓、椭偏、电学、光学或 RF 测试需求。SEM, optical, profilometry, ellipsometry, electrical, optical or RF tests.
02 使用方法02 How to Use
线宽、周期、深度、膜厚、三维形貌和面积,通常决定你应该先看哪个工艺方向。CD, period, depth, film thickness, 3D profile and area point to the first route.
基底、膜层、前道状态、温度窗口、污染风险和是否能承受湿法/等离子体。Substrate, films, prior state, temperature window and contamination risks.
提前说清楚用 SEM、显微、轮廓、电学还是光学验收,避免加工后无法判断好坏。Define SEM, optical, profilometry, electrical or optical acceptance early.
需要指导Need Guidance
我会先看它像光刻问题、刻蚀问题、镀膜问题,还是一个组合拳。别在术语里迷路,术语不会帮你做样品。I will first sort whether it looks like lithography, etch, films or a combined route.
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