应用知识库 01Application Notes 01

光学项目先看功能，再看线宽和材料。For optics, start from function before line width and material.

超表面、超透镜、波导、光栅和衍射光学结构都不只是“做个图形”。波长、偏振、数值孔径、折射率、刻蚀深度和表面粗糙度会一起决定该找哪类工艺资源。Metasurfaces, metalenses, waveguides, gratings and diffractive optics are not just patterns. Wavelength, polarization, NA, refractive index, etch depth and roughness decide the process route together.

发送光学项目需求Send Optics Request 返回应用方向Back to Applications

适合什么项目Typical Needs

  • 超透镜、超表面、偏振器件、衍射光学元件。Metalenses, metasurfaces, polarization optics and diffractive elements.
  • 光栅耦合器、亚波长光栅、光子晶体和周期阵列。Grating couplers, subwavelength gratings, photonic crystals and periodic arrays.
  • 硅光、氮化硅、石英、二氧化硅、III-V 材料上的波导和窗口结构。Waveguides and windows on silicon photonics, SiN, quartz, SiO2 and III-V materials.

先准备什么Inputs to Prepare

  • GDS/DXF/PDF 版图、最小线宽、周期、占空比、面积和阵列数量。GDS/DXF/PDF, CD, period, duty cycle, area and array count.
  • 工作波长、偏振、入射角、NA、目标效率或耦合指标。Wavelength, polarization, incident angle, NA, target efficiency or coupling metric.
  • 材料栈、膜厚、目标深度、允许粗糙度和后续测试方式。Material stack, film thickness, target depth, roughness tolerance and metrology plan.

常见风险Risks to Check

  • 侧壁角度、刻蚀深度偏差和表面粗糙度影响光学损耗。Sidewall angle, depth drift and roughness can increase optical loss.
  • 大面积图形的写场拼接、剂量均匀性和套刻误差。Field stitching, dose uniformity and overlay error on large-area patterns.
  • 金属或高折材料的附着、应力、吸收和污染问题。Adhesion, stress, absorption and contamination in metals or high-index films.

推荐判断路径Suggested Route

不是先问“能不能做”，而是先把光学目标翻译成工艺约束。Translate optical targets into process limits before asking whether it can be made.

  1. 01按线宽、面积和精度判断 EBL、激光直写（LDW）、步进式光刻（Stepper）或深紫外光刻（DUV）。Choose EBL, LDW, Stepper or DUV by CD, area and accuracy.
  2. 02按材料栈和目标深度判断 RIE、ICP、DRIE、湿法刻蚀或 Lift-off。Choose RIE, ICP, DRIE, wet etch or lift-off by stack and target depth.
  3. 03提前确认 SEM、AFM、轮廓仪、光学测试或耦合测试中哪一个是验收标准。Define whether SEM, AFM, profilometry, optical test or coupling test is the acceptance basis.

超表面/超透镜Metasurface / Metalens

重点看单元尺寸、结构高度、材料折射率、阵列面积和边缘过渡区。若目标是光学效率，建议把仿真条件和预期测试方式一起发来。Focus on unit size, height, refractive index, array area and edge transition. If efficiency matters, include simulation assumptions and test method.

EBL / LDW / DUV ICP / RIE SEM / AFM

波导/耦合器Waveguide / Coupler

波导项目常常不是线宽最小就最难，侧壁粗糙度、刻蚀深度、膜厚均匀性和耦合窗口位置更容易决定结果。Waveguide difficulty is not only minimum CD. Sidewall roughness, etch depth, film uniformity and coupling window placement often dominate.

PVD / ALD Pattern Transfer 需求清单

光栅/母版Grating / Master

周期阵列要确认周期、占空比、面积、深度、缺陷容忍度和母版复制方式。后续如果要压印，母版释放层和残胶窗口要提前讨论。For periodic arrays, confirm period, duty cycle, area, depth, defect tolerance and replication method. If imprint follows, discuss release layer and residual layer early.

NIL / Master 版图工具 提交需求