专业词入口Topic Entry

GDS 版图能打开，不代表已经适合加工。An openable GDS is not automatically fabrication-ready.

GDS 版图检查适合在电子束曝光、光刻、刻蚀、掩膜版或纳米压印母版投递前做一次快速确认。重点不是把文件“看一眼”，而是把 top cell、layer/datatype、单位、关键尺寸、阵列引用、对准 mark、有效面积和工艺说明对齐，减少报价反复和返工。GDS review aligns hierarchy, layers, units, critical dimensions, array references, marks, area and process notes before quotation or fabrication.

01

适合什么需求Good Fit

已有 GDS/OASIS，准备做电子束直写、激光直写、接触式光刻、掩膜版、ICP/RIE 刻蚀或纳米压印母版，需要先判断文件是否可投递。For GDS/OASIS files before EBL, direct writing, mask lithography, etch or nanoimprint master work.

02

需要准备什么Prepare First

GDS/OASIS 文件、目标 top cell、layer map、关键尺寸截图、材料堆栈、目标工艺、样品尺寸、对准关系和验收方式。GDS/OASIS, top cell, layer map, CD screenshots, stack, process route, sample size, overlay relation and acceptance method.

03

常见风险Common Risks

单位错一千倍、选错 top cell、layer/datatype 未说明、阵列引用展开异常、最小线宽小于工艺窗口、mark 缺失或版图超出样品有效面积。Wrong units, wrong top cell, unclear layers, broken arrays, out-of-window CDs, missing marks or area mismatch.

推荐下一步Next Step

先把“文件检查”和“工艺用途”绑在一起。Review the layout together with its process purpose.

同一个 GDS，给电子束曝光、掩膜版、Lift-off、刻蚀或纳米压印时关注点不同。提交前建议写清每一层要做什么、哪些是曝光图形、哪些是对准或切割辅助、最终希望用 SEM、轮廓、电学还是光学结果验收。微纳Hub 可以先帮你判断版图缺口，再决定是否需要改图、转 GDS、补 mark 或调整工艺路线。The same GDS may need different checks for EBL, masks, lift-off, etch or nanoimprint. Tie every layer to a process and acceptance method.

提交 GDS 版图检查需求Submit GDS review request

投递前快速清单Pre-Submission Checklist

  • 确认最终加工的 top cell，而不是示例 cell 或旧版本 cell。Confirm the final fabrication top cell.
  • 列出 layer/datatype 对应的工艺含义和材料层。Map layer/datatype to process meaning and material layers.
  • 量最小线宽、最小间距、孔径、周期和总有效面积。Measure CD, spacing, holes, period and active area.
  • 检查对准 mark、切割边界、测试结构和空白边距。Check marks, dicing boundary, test structures and margin.