应用知识库 02Application Notes 02
MEMS 和微流控，先把结构和后续连接说清楚。For MEMS and microfluidics, structure and later connection come first.
微通道、腔体、悬臂梁、喷嘴、通孔和键合结构，真正难点常常在深宽比、残留、翘曲、封接和泄漏测试。图形只是开始，后续怎么用同样重要。Microchannels, cavities, beams, nozzles, through holes and bonded stacks often fail around aspect ratio, residue, bow, sealing and leak testing. The pattern is only the beginning.
适合什么项目Typical Needs
- 硅基微通道、腔体、沟槽、喷嘴、通孔和深硅结构。Silicon microchannels, cavities, trenches, nozzles, through holes and deep silicon features.
- PDMS、玻璃、石英、硅片之间的键合、封装和流体接口。Bonding and fluidic interfaces across PDMS, glass, quartz and silicon.
- MEMS 梁、膜、悬臂、空腔、压力/流量/惯性结构验证。MEMS beams, membranes, cantilevers, cavities and pressure, flow or inertial structures.
先准备什么Inputs to Prepare
- 通道宽度、深度、入口出口、腔体尺寸、片厚和片径。Channel width, depth, inlet/outlet, cavity size, wafer thickness and wafer size.
- 材料组合、键合方式、流体类型、压力、温度和化学兼容性。Material combination, bonding method, fluid, pressure, temperature and chemical compatibility.
- 是否需要切割、打孔、封装、管路连接、显微检查或泄漏测试。Dicing, drilling, packaging, tubing, inspection and leak test requirements.
常见风险Risks to Check
- 深刻蚀侧壁波纹、底部残留、开口塌陷或薄膜破裂。Deep etch scalloping, bottom residue, opening collapse or membrane rupture.
- 键合表面颗粒、粗糙度、翘曲、污染和局部漏液。Bonding particles, roughness, bow, contamination and local leakage.
- 切割崩边、接口错位、流体死角和后续装夹不可达。Dicing chips, port misalignment, dead volume and inaccessible mounting points.
推荐判断路径Suggested Route
MEMS 项目要把“做出来”和“接得上、测得了”一起考虑。MEMS projects need fabrication, connection and testing considered together.
- 01按尺寸和深宽比判断接触式光刻、Stepper、DRIE、ICP 或湿法刻蚀。Choose contact lithography, Stepper, DRIE, ICP or wet etch by dimension and aspect ratio.
- 02按材料组合判断阳极键合、热压键合、等离子键合、胶粘或 PDMS 翻模。Choose anodic, thermal compression, plasma bonding, adhesive bonding or PDMS molding by stack.
- 03在报价前确认泄漏测试、显微检查、轮廓深度、装夹和交付形式。Define leak test, optical inspection, depth measurement, fixture and delivery format before quotation.
硅深刻蚀结构Deep Silicon Features
如果是高深宽比沟槽或通孔，要提前说明目标深度、最窄开口、侧壁要求、片厚和背面保护方式。深刻蚀不是只看“刻多深”。For high-aspect-ratio trenches or through holes, define depth, minimum opening, sidewall need, wafer thickness and backside protection. Deep etch is not only depth.
微流道和封接Microchannels and Sealing
微流控项目最好同时给出流体、压力、入口出口、管路规格和封接材料。很多返工不是图形错，而是连接方式后面才想起来。Microfluidic projects should include fluid, pressure, ports, tubing and sealing material. Many reworks come from late connection decisions, not pattern errors.
薄膜/悬空结构Membranes and Released Features
悬空膜、梁和腔体要提前看残余应力、释放窗口、清洗干燥方式和结构支撑。越薄的结构，越不能把释放当成最后一步的小事。Released membranes, beams and cavities need stress, release windows, drying and supports checked early. The thinner the structure, the less release can be treated as a detail.
