应用知识库 03Application Notes 03
电极和传感器，核心不是画线，是把接触和测试做稳。For sensors and electrodes, stable contact and testing matter as much as the layout.
叉指电极、微电极、加热器、探测器接触和生物传感窗口，往往同时涉及光刻、镀膜、Lift-off、钝化、开窗、表面处理和电学测试。Interdigitated electrodes, microelectrodes, heaters, detector contacts and biosensing windows often combine lithography, films, lift-off, passivation, windows, surface treatment and electrical tests.
适合什么项目Typical Needs
- 叉指电极（IDE）、微电极阵列、引线、焊盘和测试结构。IDEs, microelectrode arrays, leads, pads and test structures.
- 光电探测器、气体传感、生物传感、微加热器和功能薄膜器件。Photodetectors, gas sensors, biosensors, microheaters and functional film devices.
- 金属层、透明导电层、钝化层、开窗和局部表面修饰。Metal layers, transparent conductors, passivation, openings and local surface modification.
先准备什么Inputs to Prepare
- 金属体系、厚度、线宽线距、焊盘尺寸和测试针距。Metal stack, thickness, line/space, pad size and probe pitch.
- 基底绝缘性、表面粗糙度、是否需要粘附层或退火。Substrate insulation, surface roughness, adhesion layer and annealing needs.
- 是否要钝化开窗、功能化处理、封装或电学/光学测试。Passivation windows, functionalization, packaging and electrical or optical tests.
常见风险Risks to Check
- 金属附着差、Lift-off 残留、断路、短路和边缘毛刺。Poor adhesion, lift-off residue, opens, shorts and rough metal edges.
- 膜层应力、接触电阻、钝化开窗偏移和测试针接触不稳。Film stress, contact resistance, passivation window offset and unstable probing.
- 功能薄膜与溶剂、等离子、温度或后续封装不兼容。Functional film incompatibility with solvent, plasma, temperature or packaging.
推荐判断路径Suggested Route
先把电学连接和测试边界画出来，工艺路线才不会只停在版图上。Define electrical access and test boundaries before the route stops at layout only.
- 01按线宽线距、金属厚度和台阶覆盖判断光刻、Lift-off 或刻蚀路线。Use line/space, metal thickness and step coverage to choose lithography, lift-off or etch.
- 02按材料和接触需求判断 Ti/Cr/Au、Pt、Al、ITO、氧化物或功能薄膜组合。Choose Ti/Cr/Au, Pt, Al, ITO, oxides or functional films by material and contact need.
- 03把探针台测试、焊线、封装或后续功能化步骤放到工艺前一起讨论。Discuss probing, wire bonding, packaging or functionalization before fabrication starts.
叉指电极和微电极IDEs and Microelectrodes
要给出指宽、间距、指长、对数、焊盘、测试方法和目标电阻区间。小线宽只是其中一项，金属连续性和可测试性同样关键。Provide finger width, spacing, length, pair count, pads, test method and target resistance range. CD is only one part; continuity and testability matter.
钝化与开窗Passivation and Windows
如果传感区和焊盘要局部暴露，需要提前确认开窗尺寸、对准精度、钝化材料、后续液体或气体环境。If sensing areas and pads need local exposure, confirm opening size, alignment, passivation material and later liquid or gas environment.
功能薄膜和表面处理Functional Films and Surface Treatment
功能层如果怕温度、等离子、溶剂或水洗，要提前说明。很多传感器项目的失败点不是图形，而是材料被后续步骤改变了。If a functional layer is sensitive to temperature, plasma, solvents or rinsing, state it early. Many sensor failures come from post-process material changes.
